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Support services Product List

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LED-related materials evaluation support service

Quickly procure materials from a large number of suppliers! Support for the development and evaluation of LED-related materials.

Our company provides support services for the evaluation of materials related to light-emitting diodes (LEDs). When developing or evaluating LED-related materials such as coating resins, die bonding agents, and LED elements, we assist with the challenges of having only an image of the samples and tests, which can lead to delays in preparation for manufacturing requests. We hold discussions starting from a comic level or conceptual level and create samples. 【Service Features】 ■ Sample creation from an image ■ Production starting from one piece ■ Reduction of material procurement time ■ Support for evaluation tests *For more details, please refer to the PDF document or feel free to contact us.

  • Analysis Services
  • Chip type LED
  • Other polymer materials

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Open Information Research Support Service

Shorten investigation and document preparation time! Support effective use of customers' limited time.

Our company offers an "Open Information Research Support Service" that assists in the collection of publicly available information in the market and the compilation of that information. This service supports our clients by reducing their research time and the time spent on document preparation, thereby helping them make effective use of their "limited time." Past examples include market research on trends in backlight methods for LCD displays and display sizes of smartphones. [Past Examples] ■ Display Market Research - Trends in backlight methods for LCD displays - Commercial products equipped with QD displays - Display sizes of smartphones - Display sizes of tablets *For more details, please refer to the PDF document or feel free to contact us.

  • Other services

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Analysis Support Service (Cross-sectional Analysis)

Introducing services that meet a wide range of needs, such as product structure verification! Useful for defective product analysis.

We offer "Analysis Support Services (Cross-Section Analysis)" that assist in confirming the state of semiconductor device mounting and analyzing defective products. We cater to a wide range of needs, including evaluation of junctions in semiconductor devices, internal inspection of encapsulated products, and confirmation of product structures. Additionally, by combining this service with our other offerings, we can perform comparative analysis of electrical characteristics between good and defective products, as well as evaluation of mounting (junction) conditions and created items. 【Service Overview】 ■ Evaluation of junctions in semiconductor devices ■ Internal inspection of encapsulated products ■ Confirmation of product structures *For more details, please refer to the PDF document or feel free to contact us.

  • Semiconductor inspection/test equipment
  • Analysis Services
  • LED Module

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Design Business Support Services

Create images and drawings! Support for time-consuming tasks such as planning, drafting, and verification.

Our company offers a "Design Support Service" to assist with material design and jig/equipment design for various purposes such as implementation, testing, and analysis. We support tasks such as creating image diagrams for confirming requirements and envisioning finished products, as well as drawing creation using CAD. Design work, including conceptualization, drafting, and verification, is very time-consuming, and we believe you may be facing challenges in this area as well. Please feel free to consult with us. 【Service Overview】 ■ Image diagram creation for confirming requirements and envisioning finished products ■ Drawing creation using CAD *For more details, please refer to the PDF document or feel free to contact us.

  • Other CAD
  • Analysis Services
  • Prototype Services

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Analysis Support Service (Ultrasonic Deep Damage Testing)

Non-destructive testing is possible! Introducing an analysis method that detects delamination and other issues based on the propagation time and strength of ultrasound.

Our company offers analysis support services (ultrasonic testing) that are useful for confirming the state of semiconductor device packaging and analyzing defective products. Ultrasonic testing is one method of analysis that detects delamination and other issues based on the propagation time and strength of ultrasonic waves. It can not only determine the presence of delamination but also estimate its location and size. Additionally, in investigating the locations of defects in semiconductor module products, we can conduct non-destructive evaluations of joints and non-destructive internal analyses of modules, including tracking investigations of delamination at the interface between circuit boards and plating layers. 【Service Overview (Excerpt)】 ■ Non-destructive evaluation of joints - Investigation of delamination and voids at semiconductor chip joints - Investigation of voids occurring within encapsulating resin *For more details, please refer to the PDF document or feel free to contact us.

  • Analysis Services
  • Sensors
  • LED Module

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